Friday, December 4, 2009

TSV reliability issues

Interesting article at Semiconductor International regarding TSV fabrication and reliability issues with regards to the metal used for the interconnect: "Researchers Strive for Copper TSV Reliability".
Thermomechanical reliability is a must in order for 3-D ICs to enter high-volume manufacturing, but concerns continue about the reliability of copper through-silicon vias (TSVs). The issue has researchers scrambling to cope with copper thermal mismatch issues in actual chips, as opposed to test structures.

No comments:

Post a Comment

Note: Only a member of this blog may post a comment.