Saturday, May 16, 2009


On metal interconnects for next generation's 22nm technologies. And more on masks for 32 and 22 nm technologies.

An article on substrate integrated circuits (SiCs) for future Ghz and Thz electronic and photonic systems.

More buzz on 3D interconnects as the next singularity for the semiconductor industry. And a post which goes into some detail on the TSV technology which TSMC will offer soon.

A replacement for polyisilicon as gate material, by Freescale.

An interesting article on designing flexible printed circuit boards.

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